|
emmc所有分區(qū)都備份了的,就怕出意外,結(jié)果還是發(fā)生了,燒寫(xiě)自己修改后的system文件后,開(kāi)機(jī)無(wú)顯示。又重新編輯system再燒,提示燒寫(xiě)失敗,一氣之下點(diǎn)了擦除全器件(心想反正有備份)。再燒sy文件提示fastboot無(wú)法啟動(dòng),然后燒fastboot進(jìn)去,然后再燒system就怎么都燒不進(jìn)去,然后試燒其它文件也一樣無(wú)發(fā)寫(xiě)入,現(xiàn)在只有facebook可以燒進(jìn)去,啟動(dòng)盒子看報(bào)文如下:
Bootrom start
Boot from eMMC
Starting fastboot ...
System startup
DDRS
Reg Version: v1.1.0
Reg Time: 2016-3-4 14:51:59
Reg Name: hi3798mdmo1f_hi3798mv100_ddr3_1gbyte_16bitx2_2layers_emmc.reg
Jump to DDR
Fastboot 3.3.0-dirty (shaoqiang.yu@um) (Mar 28 2016 - 10:44:06)
Fastboot: Version 3.3.0
Build Date: Mar 28 2016, 10:44:43
CPU: Hi3798Mv100
Boot Media: eMMC
DDR Size: 1GB
Check nand flash controller v610. found
Special NAND id table Version 1.36
Nand ID: 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
No NAND device found!!!
MMC/SD controller initialization.
MMC/SD Card:
MID: 0x15
Read Block: 512 Bytes
Write Block: 512 Bytes
Chip Size: 3728M Bytes (High Capacity)
Name: "4FPD3"
Chip Type: MMC
Version: 5.0
Speed: 52000000Hz
Bus Width: 8bit
Boot Addr: 0 Bytes
*** Warning - bad CRC or eMMC, using default environment
Boot Env on eMMC
Env Offset: 0x00100000
Env Size: 0x00010000
Env Range: 0x00010000
HI_OTP_LockIdWord,327: ID_WORD have already been locked
SDK Version: HiSTBAndroidV600R001C00SPC063_v2016022921
HI_Flash_Open partion misc error
press the key!!
get key 0 2
get chipid =137980100
get chipType (HI3798MV100)
count=5
get chipid =137980100
get chipType (HI3798MV100)
count=5
entry_module===kernel
entry_factory_flag == 0
Failed to open partition 'stbid'
set set_default_ethaddr
HI_Flash_Open partion deviceinfo error
Reserve Memory
Start Addr: 0xFFFE000
Bound Addr: 0x8D32000
Free Addr: 0xF8FC000
Alloc Block: Addr Size
0xFBFD000 4194304
0xF8FC000 3145728
fastboot#
|
上一篇: 江蘇移動(dòng)魔百和CM101s求救磚下一篇: 聯(lián)通bestv R3300L不能安裝當(dāng)貝
|